SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Memory chip capacity can be increased by a factor of 1,000, a new discovery from a Korean team
  • 0

Memory chip capacity can be increased by a factor of 1,000, a new discovery from a Korean team

SemiMediaEdit
July 3, 2020

According to The Korea Herald report, a research team in South Korea has discovered a way to increase the storage capacity of memory chips by a factor of 1,000, while increasing the possibility of using 0.5 nanometer process technology.

The research team comes from the Ulsan National Institute of Science and Technology (UNIST) and is funded by the Samsung Science and Technology Foundation. The team’s latest discovery will enable chip manufacturers to use a new physical phenomenon to make smaller chips, and it is possible to expand data storage capacity by a factor of 1,000.

The report explained that the UNIST team’s research has found a way to control individual atoms in semiconductor materials and further increase the storage capacity of microchips and break the chip domain size limit.

The UNIST team found that by adding a drop of charge to a semiconductor material called ferroelectric hafnium oxide (HfO2), four individual atoms can be controlled to store 1 bit of data. This means that it is possible to store 500 TB of data per square centimeter in a flash memory module, which is 1,000 times that of current flash memory chips.

Related

electronic components news Memory chip capacity
Renesas adds leading power efficiency to its embedded controller RE series
Previous
STMicroelectronics expands STM32WL wireless MCU ecosystem with wM-Bus stack for smart metering from Stackforce
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
onsemi expects to produce 200mm SiC wafers by 2025
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Applied Materials Opens $5 Billion EPIC Center with TSMC, Intel and Samsung to Accelerate AI Semiconductor Innovation

Applied Materials Opens $5 Billion EPIC Center with TSMC, Intel and Samsung to Accelerate AI Semiconductor Innovation

October 14, 2026
0
Intel CEO Warns AI Hardware Shortage May Continue for 2–3 Years, Memory Market Could Cool First

Intel CEO Warns AI Hardware Shortage May Continue for 2–3 Years, Memory Market Could Cool First

October 14, 2026
0
GlobalFoundries and TSMC Sign $2 Billion Deal to Build U.S. CoWoS Supply Chain

GlobalFoundries and TSMC Sign $2 Billion Deal to Build U.S. CoWoS Supply Chain

October 12, 2026
0
South Korea Semiconductor Exports Surge 170% in Early October as AI Demand Drives Record Growth

South Korea Semiconductor Exports Surge 170% in Early October as AI Demand Drives Record Growth

October 12, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator