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ROHM releases 2nd generation MUS-IC™ series audio DAC chip for hi-res audio playback with exclusive HD monaural mode
TSMC reports up to 20,000 wafers may be scrapped due to earthquake
Samsung cuts wafer foundry investment by over 50% for 2025
BelGaN undergoes bankruptcy auction following financial troubles
TSMC halts chip production temporarily after earthquake, impact under assessment
Nexperia releases new step-down DC-DC converters with lowest quiescent current enhance design flexibility
GlobalFoundries invests $575 million to expand New York fab, advancing packaging and photonics technology
ADI to receive $105 million from U.S. Commerce Department for expansion and modernization
onsemi completes acquisition of Qorvo's silicon carbide JFET business
Japan to invest $1 billion to boost chip design industry
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