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SIA: Global semiconductor sales up 8.2% in 2023
Murata announces construction of new MLCC production facility
ASE expects Capex to reach record high in 2024
Japan’s electronic component shipments increased by 3% year-on-year in November 2023
Intel delays construction of Ohio chip fab
SK Hynix plans to build an advanced packaging factory in the United States, reports say
IC design market is expected to see significant growth
Intel announces foundry cooperation with UMC
Several new fabs in Japan are expected to start production in 2024
SK Hynix plans to increase HBM output
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