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Renesas releases low-power RL78/G15 MCUs with smallest 8-pin package option
Vishay Intertechnology eFuses Offer Wide 2.8 V to 23 V Operating Voltage Range With Active Reverse Blocking
ST's STPOWER automotive-grade devices run cooler in surface-mount ACEPACK SMIT package
TDK with TI on the world’s first sensor module with built-in edge AI and wireless mesh connectivity
NXP releases advanced automotive radar SoCs for next-generation ADAS and autonomous driving systems
NXP introduces new i.MX 95 series applications processors, delivering secure, reliable and scalable AI edge platforms
TDK releases thermally stabilized industrial IMU for tilt and stabilization applications
Diodes Incorporated's three-level configurable slew rate controlled power switch simplifies and enhances power rail management in solid-state drives
Infineon and NuCurrent collaborate to deploy market-leading smart lock and energy harvesting technology
Quectel releases its first new high-performance cellular, Wi-Fi, Bluetooth and GNSS combo antenna series
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