TI breaks ground on new 300mm wafer fab in Sherman, Texas
May 19, 2022
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NXP plans to expand chip fab in Texas
May 19, 2022
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Infineon releases dual-channel DC-DC controller for full LED headlamps without a microcontroller
May 19, 2022
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Microchip: Chip delivery impacted by epidemic prevention and control measures in Shanghai
May 18, 2022
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Nexperia expands portfolio of clip-bonded FlatPower packaged diodes with new automotive CFP2-HP device
May 18, 2022
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Renesas announces investment of 90 billion yen to increase power semiconductor capacity
May 18, 2022
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ST releases single-channel load switch for high startup current applications
May 17, 2022
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Gartner: Chip supply could see excess capacity in 2023
May 17, 2022
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onsemi releases high-efficiency USB power delivery solution
May 16, 2022
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Infineon: Producing chips in multiple locations facilitates the resilience and long-term growth of the semiconductor supply chain.
May 16, 2022
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Taiyo Yuden plans to expand MLCC production by 15% this year
May 16, 2022
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Okmetic to build new fab in Finland for SOI wafers
May 13, 2022
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