SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Renesas’ clean room at Naka factory N3 building has resumed
  • 0

Renesas’ clean room at Naka factory N3 building has resumed

SemiMediaEdit
April 12, 2021

On April 10, Renesas Electronics announced an update to the announcement regarding the occurrence of a fire on March 19, 2021 at 2:47 am at part of the processes in the N3 Building (300mm line) of its Naka Factory (located in Hitachinaka, Ibaraki Prefecture).

The update states that the operation of the N3 Building clean room has resumed from 9:00 pm, April 9. In addition to the cleaning of the floor, underfloor, walls and above and beyond the ceiling of the clean room, they have completed the decontamination of the clean room by replacing the air filters installed on the ceiling of the clean room.

Renesas said that about 1,600 people participated in the restoration work and they aim to resume production within one month of the occurrence of the fire as initially targeted.

After production restarts, Renesas will issue an announcement.

Related

electronic components news Renesas fire Renesas Naka factory
ST announces cooperation with Atos, Dassault Systèmes, Renault and Thales to create a new open ecosystem for intelligent and sustainable mobility
Previous
NXP | Object Detection Demo - i.MX 8M Plus
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Arm reshapes business, creates physical AI unit to expand robotics and automotive push

Arm reshapes business, creates physical AI unit to expand robotics and automotive push

January 9, 2026
0
ASE may raise packaging prices by 5%–20%, above prior expectations

ASE may raise packaging prices by 5%–20%, above prior expectations

January 9, 2026
0
Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

January 8, 2026
0
TSMC weighs further Arizona expansion with fabs and advanced packaging

TSMC weighs further Arizona expansion with fabs and advanced packaging

January 8, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator