SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel expands 10nm process capacity in its 3 fabs
  • 0

Intel expands 10nm process capacity in its 3 fabs

SemiMediaEdit
December 28, 2020

According to reports, in order to meet market demand, Intel’s three fabs are expanding the production of 10nm process chips.

The report said that in order to cope with huge customer demand, Intel doubled its 14nm and 10nm production capacity in the past few years. However, Intel is now focusing on the expansion of 10nm process capacity.

At this stage, Intel's three fabs in Oregon, Arizona, and Israel are all accelerating the production of chips with 10nm process.

Keyvan Esfarjani, Intel’s senior vice president and general manager of manufacturing and operations, said that Intel’s wafer production capacity has doubled in the past three years, which is a major investment. Next, Intel will continue to invest in the capacity of its fabs to ensure that it can keep up with the growing needs of customers. In addition, the progress of the 10nm process is also very smooth. At present, three fabs around the world are accelerating the production of 10nm process chips.

Related

electronic components news Intel 10nm
Mouser named Bourns 2019 North American e-Commerce Distributor of the Year
Previous
Diodes Inc. releases automotive-compliant USB Type-C port protector
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP launches i.MX 93W processor with AI engine and tri-radio connectivity

NXP launches i.MX 93W processor with AI engine and tri-radio connectivity

March 16, 2026
0
AOS to raise prices on some power chips from April

AOS to raise prices on some power chips from April

March 16, 2026
0
VIS plans wafer price increase from April amid rising chip costs

VIS plans wafer price increase from April amid rising chip costs

March 16, 2026
0
Rohm and Toshiba discuss combining power semiconductor operations

Rohm and Toshiba discuss combining power semiconductor operations

March 13, 2026
0
9
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator