SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › ON Semiconductor will showcase the latest connectivity and sensing solutions at the International IoT Exhibition
  • 0

ON Semiconductor will showcase the latest connectivity and sensing solutions at the International IoT Exhibition

SemiMediaEdit
July 27, 2020

ON Semiconductor annouced that it will showcase its wide range of Internet of Things (IoT)-enabled solutions at the International Internet of Things Exhibition to be held July 29 - 31 in Shenzhen, China. The company capitalizes on the leading trade show in Asia to demonstrate and discuss its latest IoT solutions utilizing connectivity and sensing for applications including smart home and building, personal IoT, asset monitoring, industrial, and medical.

The Smart Home and Building zone at the company’s booth will feature multiple demonstrations including connectivity using Bluetooth® Low Energy (BLE), Wi-Fi and Zigbee™ to provide low power, reliable control of lighting in both industrial and residential scenarios. Sensing demonstrations in this area will feature image sensors from ON Semiconductor that provide ultra-low-power solutions to designers working on applications such as smart video doorbells. Devices like the AR0237 provide advanced imaging performance including the ability to capture both visible and infra-red (IR) images for depth sensing, and the sensitivity in varying light conditions required for 3D imaging for intelligent access control and smart video security.

Personal IoT and Asset Monitoring are rapidly growing and exciting areas with almost limitless applications. In this zone, BLE- based solutions that utilize the company’s industry-leading RSL10 System on Chip (RSL10 SoC) will be demonstrated for applications such as asset monitoring and tracking, audio streaming and hearing aids. Other demonstrations for personal IoT include a M2M demo kit for Alibaba IoT cloud platform connectivity, an ultra-low power audio HMI solution, and a voice-triggered smart speaker using the LC823455 audio SoC.

In the Industrial demonstration area, the main feature will be a sensing solution for a machine vision based Intelligent Transportation System (ITS) that utilizes the XGS 12000 12.6 megapixel (MP) image sensor that provides high resolution image quality and uniformity. Its compatibility with standard 29 mm x 29 mm camera designs can help speed and simplify designs for customers.

ON Semiconductor will also showcase its innovative cloud-connected Strata Developer Studio™. Strata provides a seamless, personalized and secure environment in which to evaluate and design using ON Semiconductor products and solutions.

To see live demonstrations and for more innovative solutions relating to IoT design, visit ON Semiconductor’s booth 1A210-2, Hall 1 at the Shenzhen Convention & Exhibition Center. Also, an ON Semiconductor expert will address International Internet of Things Sensor Forum with “Emerging Visual IoT Solutions” at 10:20 on July 29 in seminar room 2 in Hall 9.

Related

electronic components news LC823455 ON Semiconductor RSL10 XGS 12000
Maxim | How remote patient monitoring can help us battle COVID-19
Previous
ADI releases high dynamic range RF transceiver for challenging mission-critical communications applications
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator