SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Qualcomm introduced the world’s most power-efficient single-mode 3GPP Release 14 NB2 (NB-IoT) modem.
  • 0

Qualcomm introduced the world’s most power-efficient single-mode 3GPP Release 14 NB2 (NB-IoT) modem.

SemiMediaEdit
April 21, 2020

Qualcomm recently announced a new chipset designed to help spur the burgeoning growth of the IoT market. The Qualcomm 212 LTE IoT modem is the world’s most efficient single-mode NB2 (NB-IoT) chipset, and its target market is more cost-sensitive applications and devices with limited footprint and power consumption.

"The Qualcomm 212 LTE IoT Modem will help usher in a new era for a range of IoT applications around the globe, especially those requiring connectivity deep within buildings combined with low power use, like battery-powered IoT devices that need to operate for 15 years or longer in the field," said Vieri Vanghi, Qualcomm Europe's vice president of product management.

"Its ultra-low power consumption, compact form factor, and low cost will greatly benefit OEMs creating the next generation of low-power IoT devices." Vieri Vanghi pointed out.

The modem will be available by the end of the year.

Related

electronic components news Qualcomm Qualcomm 212 LTE IoT modem single-mode NB2 (NB-IoT) chipset
A Kioxia fab suspended production due to the earthquake
Previous
IC Insights: Global semiconductor capital expenditure will drop by 3% in 2020
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

July 31, 2025
0
Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

July 31, 2025
0
Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

July 31, 2025
0
Littelfuse unveils foldback TVS diode series for advanced DC power protection

Littelfuse unveils foldback TVS diode series for advanced DC power protection

July 30, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator