SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Fire broke out at Samsung memory chip factory
  • 0

Fire broke out at Samsung memory chip factory

SemiMediaEdit
March 9, 2020

According to South Korean media reports, yesterday at 23:20, a fire broke out at Samsung Semiconductor's wastewater treatment plant in Banwol-dong, Hwaseong-si, Gyeonggi-do, and no one was injured in the fire.

According to reports, the factory is the production site of Samsung's DRAM and NAND memory chips. The cause of the fire is currently under investigation and it is speculated that the fire started from a cooling tower on the roof of the wastewater treatment plant. Samsung Electronics said that the fire occurred in the Green 2 Building, which is mainly used to treat the smell of wastewater generated during the semiconductor production process.

Samsung currently stated that production was not interrupted by the fire.

 

Related

electronic components news SAMSUNG
NXP nominates new CEO
Previous
Marvell announces partnership with Nokia on 5G chips
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

November 6, 2025
0
Nexperia B.V. reports updates on global operations and China supply chain

Nexperia B.V. reports updates on global operations and China supply chain

November 6, 2025
0
DDR memory shortages may persist until 2027, Winbond says

DDR memory shortages may persist until 2027, Winbond says

November 6, 2025
0
Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

November 5, 2025
0
4
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator