SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Toyota and Denso announce joint venture for automotive semiconductors
  • 0

Toyota and Denso announce joint venture for automotive semiconductors

SemiMediaEdit
December 11, 2019

Toyota and DENSO announced plans to establish a joint venture company MIRISE Technologies in April 2020 to research and develop next-generation automotive semiconductors.

"MIRISE" is the abbreviation of "Mobility Innovative Research Institute for Semiconductor", and the new company will be chaired by Yoshifumi Kato, Senior Executive Officer of Denso.

In terms of subdivided areas, MIRISE will focus on three technical areas: electronic power, sensing and SoC.

In the electronic power sector, Toyota and DENSO have accumulated experience in materials, manufacturing, and design technologies during the electrification of hybrid vehicles. In the future, it will mainly develop for internal manufacturing (including contract manufacturing). In terms of sensing business, in addition to internal production, joint R & D cooperation will also be carried out. In the SoC field, MIRISE will further strengthen the clarification of SoC specifications that are most suitable for future mobility.

In order to accelerate the establishment of a future competitive structure and system, the two companies are actively cooperating with universities, research institutions, startups and semiconductor-related companies, and are also strengthening the recruitment of semiconductor professionals.

Related

automotive semiconductors Denso electronic components news Toyata
TRI releases ranking of the world's top ten wafer foundries in the fourth quarter
Previous
ADI | Europe - The Centre for Key Megatrends
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

South Korea weighs $3 billion plan to build new foundry to boost chip ecosystem

South Korea weighs $3 billion plan to build new foundry to boost chip ecosystem

December 12, 2025
0
NXP to shut down ECHO fab as it retreats from 5G RF power market

NXP to shut down ECHO fab as it retreats from 5G RF power market

December 12, 2025
0
Global chip industry enters new AI-driven cycle as market heads toward $1 trillion

Global chip industry enters new AI-driven cycle as market heads toward $1 trillion

December 11, 2025
0
Murata ventures into quantum cryptography to extend semiconductor and components market

Murata ventures into quantum cryptography to extend semiconductor and components market

December 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator