SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Qrovo launches power SoC to open up new markets
  • 0

Qrovo launches power SoC to open up new markets

SemiMediaEdit
November 6, 2019

On November 5th, Qorvo announced the latest products in the Power Application Controller (PAC) series, which also means that Qrovo officially entered the power chip market.

Designed for powering brushless DC motors, the SoC, PAC5527, features high efficiency and high performance for long battery life. In addition, the SoC integrates multiple modules, including the FLASH-based high-performance 150MHz Arm Cortex-M4F, power management module, programmable current high-side and low-side gate drivers, and signal conditioning modules. This combination saves PCB space and reduces BOM by up to 30% compared to other solutions on the market.

Larry Blackledge, General Manager of Qorvo's Programmable Power Management Business Unit, commented on the product: "Qorvo is the first to introduce an integrated, controllable, programmable smart gate driver solution that integrates a high-performance FLASH MCU on a single chip. With the PAC5527, OEMs are able to design highly reliable, high-performance tools with minimal footprint."

The product comes from Qrovo's newly established programmable power management business unit, which is comprised of Active-Semi acquired this year. The new division provides power management and intelligent motor-driven expertise for major growth markets.

The latest PAC5527 is available now. For more information on this product, please refer to the Qorvo website.

Related

electronic components news PAC5527 Qorvo power SoC
Diodes Inc. introduces PCIe packet switch to meet automotive demand for advanced features
Previous
Intel: Mass production of 7nm will begin in the second half of 2021
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Global FPGA market to reach US$19.3 billion by 2030 on strong APAC demand

Global FPGA market to reach US$19.3 billion by 2030 on strong APAC demand

November 14, 2025
0
Infineon expands EV battery portfolio with new high-voltage BMS microcontroller

Infineon expands EV battery portfolio with new high-voltage BMS microcontroller

November 14, 2025
0
Samsung targets 2nm gains as it pushes to revive foundry profits

Samsung targets 2nm gains as it pushes to revive foundry profits

November 14, 2025
0
TSMC to raise sub-5nm wafer prices by up to 10% in 2026 amid strong demand

TSMC to raise sub-5nm wafer prices by up to 10% in 2026 amid strong demand

November 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator