SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Qualcomm announces that its Snapdragon X55 modem has been adopted by more than 30 OEMs worldwide
  • 0

Qualcomm announces that its Snapdragon X55 modem has been adopted by more than 30 OEMs worldwide

SemiMediaEdit
October 15, 2019

Yesterday, Qualcomm announced that more than 30 OEMs worldwide have adopted the Snapdragon X55 modem and RF system. In addition, Qualcomm revealed that its CPE supporting commercial 5G fixed wireless access (FWA) will be released in 2020.

The Snapdragon X55 was released in February this year. The chip supports 5G to 2G multimode, supports millimeter wave and below 6GHz frequency band, supports TDD and FDD, and supports independent and non-independent networking modes.

As a single chip with a 7nm process, the Snapdragon X55 supports 5G to 2G multimode and also supports millimeter and 6GHz spectrum bands. In 5G mode, it can achieve download speeds of up to 7Gbps and upload speeds of up to 3Gbps, while supporting Category 22 LTE download speeds of up to 2.5 Gbps.

According to Qualcomm, partners using the X55 chipset include Panasonic Mobile Communications, Nokia, OPPO, Arcadyan Technology, Franklin, MeiG Smart, Sharp and other well-known companies. In addition, Qualcomm is now(October 14th - 16th ) demonstrating commercial CPE terminals equipped with X55 5G modems and RF systems at the Qualcomm 5G Summit in Barcelona.

Related

electronic components news Qualcomm Snapdragon X55
ON Semiconductor's Wi-Fi chipset selected by Orange France for the new Livebox 5 gateway
Previous
JCET's new IC assembly and test base is expected to be completed by the end of November
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung delays DDR4 exit as prices and contracts keep legacy DRAM profitable

Samsung delays DDR4 exit as prices and contracts keep legacy DRAM profitable

December 25, 2025
0
Diodes expands automotive bipolar transistor lineup for power control applications

Diodes expands automotive bipolar transistor lineup for power control applications

December 22, 2025
0
TDK launches HVC27*MC compact high-voltage DC contactor with mirror contact

TDK launches HVC27*MC compact high-voltage DC contactor with mirror contact

December 19, 2025
0
Vishay launches fast-acting thin film chip fuses for circuit protection

Vishay launches fast-acting thin film chip fuses for circuit protection

December 18, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator