SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TAIYO YUDEN triples the communications range of Bluetooth® 5 compatible wireless communications module
  • 0

TAIYO YUDEN triples the communications range of Bluetooth® 5 compatible wireless communications module

SemiMediaEdit
October 15, 2019

TAIYO YUDEN CO., LTD. announced the launch of the new Bluetooth® 5 compatible wireless communications module, the EYSKDNZWB (9.6×12.9×1.4 mm). This product is best suited for outdoor-use security devices, IoT devices used in large factories, and IoT-related devices that require long-distance communications capability such as physical distribution terminals.

The new EYSKDNZWB can support a communication range that is three times as long as the existing EYSKBNZWB (15.4×10.0×2.0 mm), which supports the long-range function newly added in Bluetooth® 5, by combining Taiyo Yuden’s proprietary advanced antenna technology, small-devices design technique, and high-density design technique. This product will contribute to expanding communication range with the benefit of Bluetooth® 5 low power consumption, which will allow IoT devices to be implemented in sensor networks in large areas such as factories

Mass production of the new EYSKDNZWB will commence in November 2019, with a sample price of 3,000 yen per unit. Its target applications are IoT devices used in large factories, and IoT-related devices that are required to be capable of long-distance communications such as physical distribution terminals.

Related

Bluetooth® 5 compatible wireless communications module electronic components news EYSKDNZWB Taiyo Yuden
MPU global revenue will fall to $77.3 billion in 2019
Previous
ON Semiconductor's Wi-Fi chipset selected by Orange France for the new Livebox 5 gateway
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator