SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TAIYO YUDEN triples the communications range of Bluetooth® 5 compatible wireless communications module
  • 0

TAIYO YUDEN triples the communications range of Bluetooth® 5 compatible wireless communications module

SemiMediaEdit
October 15, 2019

TAIYO YUDEN CO., LTD. announced the launch of the new Bluetooth® 5 compatible wireless communications module, the EYSKDNZWB (9.6×12.9×1.4 mm). This product is best suited for outdoor-use security devices, IoT devices used in large factories, and IoT-related devices that require long-distance communications capability such as physical distribution terminals.

The new EYSKDNZWB can support a communication range that is three times as long as the existing EYSKBNZWB (15.4×10.0×2.0 mm), which supports the long-range function newly added in Bluetooth® 5, by combining Taiyo Yuden’s proprietary advanced antenna technology, small-devices design technique, and high-density design technique. This product will contribute to expanding communication range with the benefit of Bluetooth® 5 low power consumption, which will allow IoT devices to be implemented in sensor networks in large areas such as factories

Mass production of the new EYSKDNZWB will commence in November 2019, with a sample price of 3,000 yen per unit. Its target applications are IoT devices used in large factories, and IoT-related devices that are required to be capable of long-distance communications such as physical distribution terminals.

Related

Bluetooth® 5 compatible wireless communications module electronic components news EYSKDNZWB Taiyo Yuden
MPU global revenue will fall to $77.3 billion in 2019
Previous
ON Semiconductor's Wi-Fi chipset selected by Orange France for the new Livebox 5 gateway
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay Launches XFD11KxxCA Bidirectional TVS With 11 kW-Class Pulse Capability and Up to 207.1 A Peak Current

Vishay Launches XFD11KxxCA Bidirectional TVS With 11 kW-Class Pulse Capability and Up to 207.1 A Peak Current

September 11, 2026
0
Infineon Launches TDA235E5 and TDA235E0 With 300 A Peak Current and Over 2 A/mm² Power Density

Infineon Launches TDA235E5 and TDA235E0 With 300 A Peak Current and Over 2 A/mm² Power Density

September 8, 2026
0
Vishay Launches CHEP Thin Film Resistors With Up to 2.8 W Power and 50 GHz Operation

Vishay Launches CHEP Thin Film Resistors With Up to 2.8 W Power and 50 GHz Operation

September 7, 2026
0
Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

September 3, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator