SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TAIYO YUDEN triples the communications range of Bluetooth® 5 compatible wireless communications module
  • 0

TAIYO YUDEN triples the communications range of Bluetooth® 5 compatible wireless communications module

SemiMediaEdit
October 15, 2019

TAIYO YUDEN CO., LTD. announced the launch of the new Bluetooth® 5 compatible wireless communications module, the EYSKDNZWB (9.6×12.9×1.4 mm). This product is best suited for outdoor-use security devices, IoT devices used in large factories, and IoT-related devices that require long-distance communications capability such as physical distribution terminals.

The new EYSKDNZWB can support a communication range that is three times as long as the existing EYSKBNZWB (15.4×10.0×2.0 mm), which supports the long-range function newly added in Bluetooth® 5, by combining Taiyo Yuden’s proprietary advanced antenna technology, small-devices design technique, and high-density design technique. This product will contribute to expanding communication range with the benefit of Bluetooth® 5 low power consumption, which will allow IoT devices to be implemented in sensor networks in large areas such as factories

Mass production of the new EYSKDNZWB will commence in November 2019, with a sample price of 3,000 yen per unit. Its target applications are IoT devices used in large factories, and IoT-related devices that are required to be capable of long-distance communications such as physical distribution terminals.

Related

Bluetooth® 5 compatible wireless communications module electronic components news EYSKDNZWB Taiyo Yuden
MPU global revenue will fall to $77.3 billion in 2019
Previous
ON Semiconductor's Wi-Fi chipset selected by Orange France for the new Livebox 5 gateway
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features

Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features

September 18, 2025
0
Global cellular IoT module shipments rise 17% in Q2, led by China and India

Global cellular IoT module shipments rise 17% in Q2, led by China and India

September 18, 2025
0
TSMC market share jumps to 38% as Foundry 2.0 growth accelerates

TSMC market share jumps to 38% as Foundry 2.0 growth accelerates

September 17, 2025
0
Japan grants $3.6 bln to Micron for advanced memory expansion in Hiroshima

Japan grants $3.6 bln to Micron for advanced memory expansion in Hiroshima

September 17, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator