SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TE announces acquisition of MEMS pressure sensor manufacturer Silicon Microstructures
  • 0

TE announces acquisition of MEMS pressure sensor manufacturer Silicon Microstructures

SemiMediaEdit
September 30, 2019

According to reports, TE Connectivity will acquire Silicon Microstructures, a MEMS pressure sensor manufacturer based in California.

Silicon Microstructures has a 25-year history and was acquired by Elmos Semiconducto in 2001. Silicon Microstructures has its own MEMS fab in California, which develops and manufactures MEMS pressure and flow sensors for industrial and automotive applications, including those specifically designed for ultra-low voltage, ultra-high voltage, harsh environments and space-constrained applications. In addition, Silicon Microstructures expands its healthcare business with products such as IntraSense, which are used for in vivo pressure measurement of invasive medical devices such as catheters and endoscopes.

Anton Mindl, CEO of Elmos Semiconductor, said in a statement: "The IntraSense family of products has now reached a certain stage, and through a well-funded and broad-based market partner, it can occupy the market faster and expand revenue. ”

According to Elmos, the sale of Silicon Microstructures will mark the discontinuation of Elmos' MEMS business. Elmos will focus on its core semiconductor business, primarily for automotive communications, security, powertrain and networking applications.

TE will complete the transaction through its Measurement Specialties subsidiary in Pennsylvania, USA, and Silicon Microstructures will be part of Measurement Specialties. Measurement Specialtiesshi is a sensor manufacturer and was acquired by TE in 2014. The deal combines Silicon Microstructures' MEMS design and manufacturing capabilities with Tyco Electronics' operational scale, customer base and existing sensor portfolio to create synergies.

The transaction is expected to be completed by the end of 2019. As of the date of publication, the parties have not disclosed the specific amount of the transaction.

Related

electronic components news MEMS supplier TE acquires Silicon Microstructures
Avnet and Alibaba work together to expand China's electronic components e-commerce market
Previous
Silicon Labs introduces new mesh network module to simplify secure IoT product design
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

August 20, 2025
0
TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

August 20, 2025
0
SK Hynix strengthens balance sheet on booming HBM demand

SK Hynix strengthens balance sheet on booming HBM demand

August 20, 2025
0
Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

August 19, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator