SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › IBM receives 275 million semiconductor security orders from the US Department of Defense
  • 0

IBM receives 275 million semiconductor security orders from the US Department of Defense

SemiMediaEdit
May 24, 2019

According to media reports, IBM has received a $275 million contract from the US Department of Defense to help create a reliable supply chain focused on semiconductor technology security.

The US Department of Defense said on Tuesday that IBM and DEMA (The Defense Microelectronics Activity) will work to create a manufacturing process embedded in the interior of semiconductor process facilities.

The contract supports the Trusted Foundry Access II program to further protect the business environment and help US federal agencies acquire advanced technology manufacturing capabilities. In addition, other services for the contract will include subject matter expertise and consulting to assess and propose other tasks. IBM will also help DEMA evaluate new facilities, system tools and processes to further achieve strategic goals.

Ms. Kristen J. Baldwin of the US Department of Defense said that microelectronics is part of the US Department of Defense's top key technology areas, including quantum computing, artificial intelligence, advanced manufacturing, space and biotechnology. Baldwin pointed out that China is investing 150 billion US dollars in microelectronics technology, and not only in China, but also establish national and industry partnerships with other international partners. In response to foreign microelectronics investments and strengthening the US industrial base, the Department of Defense plans to significantly increase research funding for the technology.

Related

electronic components news IBM semiconductor
The problems in the semiconductor industry itself are more serious than the Huawei ban.
Previous
Lattice Semiconductor | MachX03D FPGA
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Denso drops Rohm acquisition plan, keeps focus on SiC collaboration

Denso drops Rohm acquisition plan, keeps focus on SiC collaboration

May 4, 2026
0
Murata ramps up ultra-low power AMR sensor output for wearable and IoT use

Murata ramps up ultra-low power AMR sensor output for wearable and IoT use

May 4, 2026
0
ADI rolls out A²B 2.0 for automotive audio with higher bandwidth

ADI rolls out A²B 2.0 for automotive audio with higher bandwidth

May 1, 2026
0
Microchip expands atomic clock production capacity with new Alabama facility

Microchip expands atomic clock production capacity with new Alabama facility

May 1, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator