SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Yageo announces the merger of Teapo and Jamicon
  • 0

Yageo announces the merger of Teapo and Jamicon

SemiMediaEdit
March 15, 2019

On March 12th, Teapo Electronic Corporation and Jamicon Corporation, two manufacturers of aluminum electrolytic capacitors under the Yageo Group, announced the suspension of trading. Prior to this, Teapo held more than 40% of Jamicon's shares, and it is speculated that Teapo may acquire all of Jamicon's shares.

On March 14, Yageo stated that Teapo and Jamicon were formally merged. After the merger, the company will no longer be limited to the passive component industry, and will supply key components to the market in the future. At present, Teapo and Jamicon's main products are aluminum electrolytic capacitors. They have large-scale aluminum capacitor products. In addition to strengthening the life and miniaturization of existing products, they are also committed to developing products for the automotive market, such as liquid capacitors and pin-type solid capacitors.

In addition, Yageo also stated that after the merger of Teapo and Jamicon, it may acquire Tong Hsing Electronic Industries, Ltd., whose main business is engaged in ceramic circuit boards, high-frequency wireless communication modules, hybrid integrated circuit modules, system integration modules and the construction of the image sensor. In addition to the automotive market, it also covers the field of communications. Based on the current situation, it is expected that the merger will be Yageo's strategic layout in the automotive and communications fields.

Related

electronic components news. Yageo Jamicon Teapo
Globalfoundries: Fab 7 in Singapore is not for sale
Previous
Passive component inventory adjustment ends, prices may continue to decline in the second quarter
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

PCB prices rise on supply disruptions and AI demand

PCB prices rise on supply disruptions and AI demand

April 29, 2026
0
Intel lifts margins by selling lower-grade chips as AI demand tightens CPU supply

Intel lifts margins by selling lower-grade chips as AI demand tightens CPU supply

April 28, 2026
0
Omdia sees 62.7% semiconductor revenue growth in 2026

Omdia sees 62.7% semiconductor revenue growth in 2026

April 28, 2026
0
Power semiconductor lead times hit 30 weeks as AI drives 800V shift

Power semiconductor lead times hit 30 weeks as AI drives 800V shift

April 27, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator