SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Yageo announces the merger of Teapo and Jamicon
  • 0

Yageo announces the merger of Teapo and Jamicon

SemiMediaEdit
March 15, 2019

On March 12th, Teapo Electronic Corporation and Jamicon Corporation, two manufacturers of aluminum electrolytic capacitors under the Yageo Group, announced the suspension of trading. Prior to this, Teapo held more than 40% of Jamicon's shares, and it is speculated that Teapo may acquire all of Jamicon's shares.

On March 14, Yageo stated that Teapo and Jamicon were formally merged. After the merger, the company will no longer be limited to the passive component industry, and will supply key components to the market in the future. At present, Teapo and Jamicon's main products are aluminum electrolytic capacitors. They have large-scale aluminum capacitor products. In addition to strengthening the life and miniaturization of existing products, they are also committed to developing products for the automotive market, such as liquid capacitors and pin-type solid capacitors.

In addition, Yageo also stated that after the merger of Teapo and Jamicon, it may acquire Tong Hsing Electronic Industries, Ltd., whose main business is engaged in ceramic circuit boards, high-frequency wireless communication modules, hybrid integrated circuit modules, system integration modules and the construction of the image sensor. In addition to the automotive market, it also covers the field of communications. Based on the current situation, it is expected that the merger will be Yageo's strategic layout in the automotive and communications fields.

Related

electronic components news. Yageo Jamicon Teapo
Globalfoundries: Fab 7 in Singapore is not for sale
Previous
Passive component inventory adjustment ends, prices may continue to decline in the second quarter
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

January 19, 2026
0
Samsung to shut 8-inch S7 fab as mature-node wafer capacity tightens

Samsung to shut 8-inch S7 fab as mature-node wafer capacity tightens

January 19, 2026
0
Micron to buy PSMC fab facilities in $1.8 billion DRAM-linked deal

Micron to buy PSMC fab facilities in $1.8 billion DRAM-linked deal

January 19, 2026
0
8-inch wafer foundry capacity tightens in 2026 as utilization rises

8-inch wafer foundry capacity tightens in 2026 as utilization rises

January 16, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator