SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Micron acquires all of Intel's shares in IM Flash for $1.5 billion
  • 0

Micron acquires all of Intel's shares in IM Flash for $1.5 billion

SemiMediaEdit
October 19, 2018

Micron announced that it will acquire Intel's shareholding in IM Flash Technologies, a joint venture between Micron and Intel, for $1.5 billion in cash.

Under the previous agreement, Micron will sell 3D Xpoint memory wafers to Intel for one year after the acquisition. At the end of the transaction, IM Flash will become a wholly-owned subsidiary of Micron, and all its employees will be incorporated into Micron's technology R&D and manufacturing team in Lihai, Utah. It is understood that IM Flash produces 3D Xpoint and is mainly used in data centers and high-end computers.

Sanjay Mehrotra, President and CEO of Micron, pointed out that Micron believes that emerging memory technologies such as 3D XPoint can bring unique differences to the company, and applications that require large amounts of data also need these technologies as the foundation solution.

It can be seen from this acquisition that Micron will fully promote the second generation of 3D Xpoint in 2019. According to industry analysts, the prospects for DRAM and NAND are not optimistic, the 3D Xpoint may become Micron's next market advantage.

Related

Electronic component news IM Flash Intel Mergers and acquisitions MICRON
ADI introduces an analog-to-digital converter that simplifies PLC module development
Previous
Avnet | Meet the new global Avnet Integrated
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Nvidia increases H200 chip production to meet growing demand in China

Nvidia increases H200 chip production to meet growing demand in China

January 1, 2026
0
AI chip boom drives wafer foundry 2.0 revenue up 17% in Q3

AI chip boom drives wafer foundry 2.0 revenue up 17% in Q3

December 31, 2025
0
TSMC speeds up 3nm production at Arizona facility, targets 2027 launch

TSMC speeds up 3nm production at Arizona facility, targets 2027 launch

December 31, 2025
0
Wingtech takes legal action to protect Nexperia shareholder rights, claims could reach $8 billion

Wingtech takes legal action to protect Nexperia shareholder rights, claims could reach $8 billion

December 30, 2025
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator