SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel denies outsourcing 14nm chips to TSMC
  • 0

Intel denies outsourcing 14nm chips to TSMC

SemiMediaEdit
September 14, 2018

Recently, Intel's 14-nanometer chip supply is tight due to insufficient production capacity. A while ago, there was news that Intel turned to TSMC for help, but Intel issued a statement on the 12th to refute this rumor.

The reason for Intel's tight production capacity is that the new 10nm process has encountered obstacles, the ninth-generation processor is forced to use the 14nm process, the H370/B360 motherboard chipset that was originally produced in the 22nm process is also advanced to 14nm. These has led to the inability of the existing production capacity to cope.

According to media reports, Intel said in a statement that it will expands its 14-nanometer production capacity to cope with the increased demand for solving the problem of tight supply,  indirectly denial the rumor that to outsourced the 14-nanometer production capacity to TSMC.

There are only a few weeks left before the ninth-generation processor and the 14-nm Z390 motherboard chipset are on the market. It is still unknown when Intel expands its 14-nanometer capacity.

Related

14nm chips Electronic component news Intel TSMC
Intel CPU shortage is further affecting the server industry
Previous
UMC may acquire Globalfoundries
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP launches i.MX 93W processor with AI engine and tri-radio connectivity

NXP launches i.MX 93W processor with AI engine and tri-radio connectivity

March 16, 2026
0
AOS to raise prices on some power chips from April

AOS to raise prices on some power chips from April

March 16, 2026
0
VIS plans wafer price increase from April amid rising chip costs

VIS plans wafer price increase from April amid rising chip costs

March 16, 2026
0
Rohm and Toshiba discuss combining power semiconductor operations

Rohm and Toshiba discuss combining power semiconductor operations

March 13, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator