October 30, 2025 /SemiMedia/ — Toshiba Devices & Storage, a subsidiary of Toshiba Corp., has ended its technical collaboration framework with China-based silicon carbide (SiC) wafer supplier Tianyue Advanced, citing mutual agreement between the parties.

The two companies had signed a memorandum of understanding in August last year to enhance SiC wafer quality and stabilize supply. Toshiba said the framework was formally terminated last month after further discussions.

A source familiar with the matter said the move reflects growing caution in semiconductor cooperation involving sensitive technologies. “Chips are strategic assets tied to economic security,” the source noted. “Any cross-border collaboration that extends beyond procurement requires careful consideration.”

Toshiba had already been purchasing SiC wafers from Tianyue and is expected to continue doing so, but will halt joint technical activities.

Industry observers believe Toshiba reassessed the deal due to concerns over technology transfer and national security. “Given rising competition, Japanese companies are becoming more cautious about protecting intellectual property and retaining skilled talent,” one semiconductor consultant said.

The decision highlights Japan’s broader effort to secure its semiconductor supply chain and maintain technological sovereignty amid ongoing geopolitical tensions.