July 14, 2025 /SemiMedia/ — Intel has expanded workforce reductions across multiple U.S. locations and its Israel operations, as part of a broader cost-cutting effort aimed at refocusing on core semiconductor engineering.

In the United States, Intel is set to eliminate nearly 4,000 jobs, including up to 2,392 roles at its Oregon facilities. The revised figure marks one of the largest layoffs in Oregon’s history, significantly higher than the initially reported 500. Cuts are centered at the company’s Aloha (192) and Hillsboro (2,200) plants, which together represent about 12% of Intel’s local workforce.

Unlike previous buyout-driven programs, this round involves direct layoffs affecting primarily front-line engineering and manufacturing roles—325 module equipment technicians, 302 module development engineers, 126 module engineers, and 88 process integration development engineers. Only 190 affected positions (8%) carried the “manager” title, counter to Intel’s stated aim of cutting middle management.

In Israel, Intel has also trimmed staff, including shift supervisors, team leads, and remote operations center (ROC) technicians responsible for monitoring fab equipment and managing workflows. The company is automating many of these tasks, a trend expected to continue at U.S. fabs.

Intel is no longer announcing centralized mass layoffs. Instead, each department is responsible for achieving financial targets through its own measures. Marketing operations have already been outsourced to Accenture, and the automotive chip business is being wound down. The restructuring reflects Intel’s strategy to reduce overhead while reinforcing its focus on engineering execution within chip manufacturing.