May 26, 2025 /SemiMedia/ — Silicon Labs has introduced its first Series 3 wireless SoCs, the SiXG301 and SiXG302, built on a 22-nanometer process node, signaling a strategic shift toward higher performance and integration in semiconductor solutions for the Internet of Things (IoT).

The SiXG301 is tailored for line-powered smart devices and includes an integrated LED pre-driver, while supporting Bluetooth, Zigbee, Thread, and Matter protocols. Its 4 MB Flash and 512 kB RAM provide ample headroom for increasingly complex applications. The chip supports concurrent multi-protocol operations, streamlining manufacturing and improving device interoperability. General availability is expected in Q3 2025.

For battery-powered designs, the upcoming SiXG302 offers ultra-low power consumption at just 15 µA/MHz active current—30% lower than competing devices—making it suitable for wireless sensors and actuators. Sampling is planned for 2026.

Silicon Labs’ Series 3 platform is designed to meet rising IoT demands, offering a scalable, secure architecture that simplifies integration and accelerates time-to-market. The lineup includes multi-protocol “M” versions (SiMG301/302) and Bluetooth LE-focused “B” variants (SiBG301/302).

The adoption of a 22nm node positions Silicon Labs to support emerging applications across smart cities, industrial automation, healthcare, and connected home markets, reinforcing its commitment to edge innovation and semiconductor advancement.

To learn more about the Series 3 platform, visit: