April 11, 2025 /SemiMedia/ — Global semiconductor equipment sales are projected to grow 10% in 2024 to $117.1 billion, up from $106.3 billion in 2023, according to a new report by SEMI.
The growth is fueled by increased investments in advanced logic, high-bandwidth memory (HBM), and advanced packaging capacity, with mainland China leading the surge. China’s equipment spending is expected to rise 35% year-over-year to $49.6 billion, securing its position as the world’s largest market. The increase reflects aggressive capacity expansion and government-backed efforts to strengthen domestic chip production.
Sales of wafer fabrication equipment are projected to rise 9% in 2024, while other front-end segments are set to grow 5%. The backend segment is also rebounding after two years of decline, with assembly and packaging equipment sales jumping 25% and test equipment up 20%, supported by rising AI and HBM demand.
South Korea is forecast to remain the second-largest market with $20.5 billion in spending, a 3% increase, driven by a rebound in memory demand. Taiwan’s equipment spending is expected to decline 16% to $16.6 billion, amid slower new capacity buildouts. North America’s investment is projected to grow 14% to $13.7 billion, reflecting continued emphasis on domestic manufacturing and advanced technology nodes.
All Comments (0)