February 25, 2025 /SemiMedia/ — TSMC's Japanese subsidiary, JASM (Japan Advanced Semiconductor Manufacturing), plans to build a second wafer fab in Kumamoto. While construction may begin later than initially expected in the first quarter of 2025, production is still slated to start by the end of 2027.

The new facility will be located east of the first fab, covering 321,000 square meters and costing approximately ¥2.1 trillion (around $14.04 billion). It will focus on the production of 6nm process node chips. JASM President Yuichi Horita confirmed at the 2025 Kumamoto Industry Revitalization Expo that despite potential delays, the production timeline remains intact.

JASM’s Kumamoto first fab began mass production in 2024, with plans to expand capacity in the coming years. Horita emphasized the company's goal of increasing Japan’s semiconductor material procurement rate to 60% by 2030 and expressed hopes for deeper cooperation between Taiwanese manufacturers and local Kumamoto businesses to foster investments in advanced materials production.