May 28, 2024 /SemiMedia/ -- Toshiba Electronic Devices & Storage Corporation recently announced the completion of its 300mm wafer power semiconductor manufacturing factory and office building.

The completion of construction is an important milestone in the first phase of Toshiba's multi-year investment plan. Toshiba will currently install the equipment and strive to start mass production in the second half of fiscal year 2024.

Once the first phase of the project is fully put into production, Toshiba's MOSFET and IGBT production capacity will be 2.5 times what it was when the investment plan was formulated in fiscal 2021.

In addition, Toshiba said it will also receive a grant from Japan's Ministry of Economy, Trade and Industry to subsidize some of its investment in manufacturing equipment.

Going forward, the company will further contribute to carbon neutrality by expanding production capacity through new factories.