SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Malaysia builds Southeast Asia’s largest IC design park
  • 0

Malaysia builds Southeast Asia’s largest IC design park

SemiMediaEdit
April 23, 2024

April 23, 2024 /SemiMedia/ -- Malaysia recently announced that it will build the largest integrated circuit design park in Southeast Asia and will provide a number of incentives such as tax cuts, subsidies and free work visas to attract global technology companies and investors.

The Malaysian government plans to build the country into a digital industry center in Southeast Asia, with the goal of becoming one of the top 20 countries in the Global Startup Ecosystem Index by 2030 at the latest.

Malaysia is now an important participant in the global semiconductor industry, accounting for approximately 13% of the world's packaging and testing capacity. However, Malaysia has stated that it will strive to shift from back-end industries such as packaging and testing to high-value front-end industries such as design.

In addition, the Malaysian government will provide incentives such as office space subsidies, employment pass fee exemptions, relocation services and preferential corporate tax rates to attract foreign venture capital companies, technology entrepreneurs and unicorn companies to invest.

Related

electronic components news Electronic components supplier Electronic parts supplier Malaysia IC design park
Silicon Labs launches new wireless SoC to simplify battery-free IoT energy harvesting product development
Previous
TDK releases compact snap-in capacitors for general purpose applications
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

February 9, 2026
0
TSMC plans 3nm chip production in Japan, investment seen rising to $17 bln

TSMC plans 3nm chip production in Japan, investment seen rising to $17 bln

February 9, 2026
0
Omron issues price hike notice as automation and core components face cost pressure

Omron issues price hike notice as automation and core components face cost pressure

February 9, 2026
0
Infineon to raise prices on power devices and ICs from April amid AI-driven demand

Infineon to raise prices on power devices and ICs from April amid AI-driven demand

February 6, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator