SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Malaysia builds Southeast Asia’s largest IC design park
  • 0

Malaysia builds Southeast Asia’s largest IC design park

SemiMediaEdit
April 23, 2024

April 23, 2024 /SemiMedia/ -- Malaysia recently announced that it will build the largest integrated circuit design park in Southeast Asia and will provide a number of incentives such as tax cuts, subsidies and free work visas to attract global technology companies and investors.

The Malaysian government plans to build the country into a digital industry center in Southeast Asia, with the goal of becoming one of the top 20 countries in the Global Startup Ecosystem Index by 2030 at the latest.

Malaysia is now an important participant in the global semiconductor industry, accounting for approximately 13% of the world's packaging and testing capacity. However, Malaysia has stated that it will strive to shift from back-end industries such as packaging and testing to high-value front-end industries such as design.

In addition, the Malaysian government will provide incentives such as office space subsidies, employment pass fee exemptions, relocation services and preferential corporate tax rates to attract foreign venture capital companies, technology entrepreneurs and unicorn companies to invest.

Related

electronic components news Electronic components supplier Electronic parts supplier Malaysia IC design park
Silicon Labs launches new wireless SoC to simplify battery-free IoT energy harvesting product development
Previous
TDK releases compact snap-in capacitors for general purpose applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP launches i.MX 93W processor with AI engine and tri-radio connectivity

NXP launches i.MX 93W processor with AI engine and tri-radio connectivity

March 16, 2026
0
AOS to raise prices on some power chips from April

AOS to raise prices on some power chips from April

March 16, 2026
0
VIS plans wafer price increase from April amid rising chip costs

VIS plans wafer price increase from April amid rising chip costs

March 16, 2026
0
Rohm and Toshiba discuss combining power semiconductor operations

Rohm and Toshiba discuss combining power semiconductor operations

March 13, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator