April 19, 2024 /SemiMedia/ -- SK Hynix recently announced that it will work closely with TSMC on the production of next-generation HBM products and on strengthening advanced packaging technology that integrates HBM and logic layers. The two parties recently signed a memorandum of understanding (MOU). The company plans to cooperate with TSMC to develop HBM4, the sixth-generation HBM product, which is expected to be put into production in 2026.
"As a leader in the memory field for AI applications, working together with TSMC, the world's top logic foundry, will continue to lead HBM's technological innovation. By building a tripartite technical cooperation between IC design factories, wafer foundries, and memory factories, We will achieve new breakthroughs in memory product performance," SK hynix said.
The two companies will first focus on improving the performance of BaseDie, the lowest layer installed in the HBM package. At the same time, the two parties will work together to optimize the integration of SK Hynix's HBM products and TSMC's CoWoS technology to jointly respond to the requirements of HBM-related customers.
"Through our partnership with TSMC, we will not only develop the highest performance HBM4, but also actively expand OpenCollaboration with global customers. In the future, we will enhance the competitiveness of CustomMemoryPlatform, to consolidate the company's position as a all-round memory supplier for AI," said Kim Joo-sun, President of SK Hynix AI Infra.
"TSMC and SK Hynix have established a solid partnership over the years. By integrating the most advanced logic processes and HBM products, TSMC has provided the world's leading AI solutions to the market. Looking forward to the new generation of HBM4, we believe The two companies are also working closely to provide the best integrated products and become a key driver to develop new AI innovations for our joint customers," TSMC said.
