SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Microchip launches integrated driver power solution aimed at easing the aviation industry’s transition to more electric aircraft
  • 0

Microchip launches integrated driver power solution aimed at easing the aviation industry’s transition to more electric aircraft

SemiMediaEdit
April 17, 2024

April 17, 2024 /SemiMedia/ -- Microchip Technology recently announced a new integrated actuation power solution that combines companion gate driver boards with our expansive Hybrid Power Drive (HPD) modules in silicon carbide or silicon technology with a power range of 5 kVA to 20 kVA.

The new integrated actuation power solution maintains the same footprint regardless of the power output. The companion gate driver boards are designed to be integrated with Microchip’s HPD modules to provide an all-in-one motor drive solution for the electrification of systems such as flight controls, braking and landing gear. Microchip’s power solutions are designed to scale based on the requirements of the end application, from smaller actuation systems for drones to high-power actuation systems for Electric Vertical Take-Off and Landing (eVTOL) aircraft, MEA and all-electric aircraft.  

“We developed the companion gate driver boards to be used with our existing HPD modules to bring to market a plug-and-play power solution for MEA,” said Leon Gross, vice president of Microchip’s discrete product group. “With this solution, customers no longer need to design and develop their own drive circuitry, which can reduce design time, resources and cost.”

These high-reliability devices are tested to conditions outlined in DO-160, “Environmental Conditions and Test Procedures for Airborne Equipment.” There are multiple protection features including shoot-through detection, short circuit protection, desaturation protection, Under Voltage Lock Out (UVLO) and active miller clamping.

The gate driver boards are designed to be driven with external PWM signals based on Low Voltage Differential Signaling (LVDS) compliant with TIA/EIA-644 for low Electromagnetic Interference (EMI) and good noise immunity. The gate driver board provides differential outputs for telemetry signals like DC bus current, phase current and solenoid current by taking feedback from shunts present in the HPD module and DC bus voltage. It also provides direct output of two PT1000 temperature sensors available in the HPD power module.

The companion gate driver boards are low-weight, low-profile and compact solutions to optimize size and power efficiency of actuation systems. The gate drivers are designed to operate throughout the temperature range of −55°C to +110°C, which is critical for aviation applications that are often exposed to harsh environments.

The isolated companion gate driver boards only require a single 15V DC input for the control and drive circuit; additional voltages needed can be generated on the card. This significantly reduces the number of system components and simplifies system cabling.

For more information, please visit: https://www.microchip.com/en-us/products/power-management/power-modules/integrated-actuation-power-solution.

Related

electronic components news Electronic components supplier Electronic parts supplier Microchip
Rapidus opens subsidiary in Silicon Valley to win orders from AI startups
Previous
OpenAI seeks cooperation with Japan to purchase AI chips
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Tower Semiconductor confirms it exited India fab project months ago

Tower Semiconductor confirms it exited India fab project months ago

May 20, 2025
0
TSMC plans wafer price hike, gains Nvidia’s support amid rising AI chip complexity

TSMC plans wafer price hike, gains Nvidia’s support amid rising AI chip complexity

May 20, 2025
0
Renesas launches RZ/A3M MPU with integrated memory for low-cost, high-performance HMI systems

Renesas launches RZ/A3M MPU with integrated memory for low-cost, high-performance HMI systems

May 20, 2025
0
TDK to accelerate silicon battery shipments for slimmer AI smartphones

TDK to accelerate silicon battery shipments for slimmer AI smartphones

May 19, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator