SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Micron breaks ground on Xi'an packaging and testing factory expansion
  • 0

Micron breaks ground on Xi'an packaging and testing factory expansion

SemiMediaEdit
March 28, 2024

March 28, 2024 /SemiMedia/ -- Micron announced that it has officially broken ground on its new packaging and testing factory in Xi'an, China. Micron also announced at the groundbreaking ceremony that the company will establish Micron's first packaging and testing manufacturing sustainability center of excellence (CoE) in Xi'an to promote the company's partnerships in environmental, social and governance (ESG) and achieve global sustainability development Goals.

In June 2023, Micron announced an additional investment of 4.3 billion yuan in Xi'an, which includes the construction of a new factory, the introduction of new production lines, and the manufacture of a wider range of product solutions, including but not limited to mobile DRAM, NAND and SSD, thus expanding the existing DRAM packaging and testing capabilities of the Xi'an factory.

In addition, Micron will invest in multiple engineering laboratories in the Xi'an factory to improve the efficiency of product reliability certification, monitoring, fault analysis and debugging, thereby helping customers speed up product launch time.

The new factory is expected to be put into operation in the second half of 2025 and will gradually increase production according to market demand. After the completion of the new factory, Micron's Xi'an factory will have a total area of more than 132,000 square meters (1.4 million square feet).

Related

electronic components news Electronic components supplier Electronic parts supplier Micron Xi’an
TrendForce: DRAM price increase expected to drop to 3% to 8% in second quarter
Previous
Renesas releases world’s first general-purpose 32-bit RISC-V MCU with in-house developed CPU core
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

November 5, 2025
0
EU and China make progress on Nexperia export talks as auto chip supply remains tight

EU and China make progress on Nexperia export talks as auto chip supply remains tight

November 5, 2025
0
GF and Silicon Labs expand US-based output to support low-power wireless SoCs

GF and Silicon Labs expand US-based output to support low-power wireless SoCs

November 5, 2025
0
DDR5 supply disruption intensifies as DRAM makers delay fourth-quarter contract pricing

DDR5 supply disruption intensifies as DRAM makers delay fourth-quarter contract pricing

November 4, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator