SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASE expects Capex to reach record high in 2024
  • 0

ASE expects Capex to reach record high in 2024

SemiMediaEdit
February 6, 2024

February 6, 2024 /SemiMedia/ -- Semiconductor packaging and testing company ASE Group recently stated that in response to the expansion of advanced packaging production capacity, overall capital expenditures are expected to expand by 40% to 50% in 2024, reaching a record high.

ASE expects capital expenditures this year to increase by 40% to 50% compared with last year, of which 65% will be spent on packaging, especially advanced packaging. Currently, 60% of ASE's production capacity is used in packaging and testing, and 30% is used in electronic Manufacturing services.

ASE's overall capital expenditure, including machinery and equipment, last year was approximately US$1.5 billion. It is estimated that investment and control capital expenditure this year will exceed US$2.1 billion and reach US$2.25 billion, a new high since the company was founded.

ASE said that this year will be a year of recovery for semiconductors. Revenue is expected to show quarterly growth in the first half of the year. In the second half of the year, as customers complete destocking, it will enter the peak season, and the full-year operation will be better than last year.

Related

ASE electronic components news Electronic components supplier Electronic parts supplier
ST launches low-offset, zero-drift op amp offering wide gain bandwidth for high-precision sensing
Previous
Vishay launches new compact high-speed PIN photodiode offering enhanced visible light sensitivity
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

PCB prices rise on supply disruptions and AI demand

PCB prices rise on supply disruptions and AI demand

April 29, 2026
0
Microchip launches PQC-ready root of trust controllers for secure platforms

Microchip launches PQC-ready root of trust controllers for secure platforms

April 29, 2026
0
Intel lifts margins by selling lower-grade chips as AI demand tightens CPU supply

Intel lifts margins by selling lower-grade chips as AI demand tightens CPU supply

April 28, 2026
0
ROHM launches NFC wireless power chipset for compact wearables

ROHM launches NFC wireless power chipset for compact wearables

April 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator