SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel delays construction of Ohio chip fab
  • 0

Intel delays construction of Ohio chip fab

SemiMediaEdit
February 5, 2024

February 5, 2024 /SemiMedia/ -- According to reports, Intel plans to delay the construction schedule of a $20 billion chip manufacturing project in Ohio due to market challenges and slow U.S. government funding.

Intel Ohio originally planned to start chip manufacturing in 2025. However, according to the latest plan, the construction of the production facilities is not expected to be completed until the end of 2026.

In addition, production equipment will need to be installed after construction is completed, which means the start of production will be later than the end of 2026.

"We are fully committed to completing this project and construction continues. We made great progress last year. However, managing large projects requires constant adaptation to change." An Intel spokesperson said.

Related

electronic components news Electronic components supplier Electronic parts supplier Intel
Murata launches new automotive-grade power inductors with improved DC resistance and current rating
Previous
Japan’s electronic component shipments increased by 3% year-on-year in November 2023
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TSMC Ex-Executive Accused of Leaking Trade Secrets to Intel, Police Raid Properties

TSMC Ex-Executive Accused of Leaking Trade Secrets to Intel, Police Raid Properties

November 28, 2025
0
China and EU push for progress on Nexperia case as chip supply risks persist

China and EU push for progress on Nexperia case as chip supply risks persist

November 27, 2025
0
DRAM prices set to climb in Q4 as HBM demand tightens supply

DRAM prices set to climb in Q4 as HBM demand tightens supply

November 27, 2025
0
Rapidus advances 1.4nm roadmap as Japan strengthens push into leading-edge chipmaking

Rapidus advances 1.4nm roadmap as Japan strengthens push into leading-edge chipmaking

November 27, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator