November 14, 2023 /SemiMedia/ -- According to reports, after NVIDIA increased its orders to TSMC in October, Apple, AMD, Broadcom, Marvell and other companies also began to increase orders. In response to the needs of the above-mentioned five major customers, TSMC will accelerate the expansion of CoWoS advanced packaging production capacity. TSMC is expected to increase its monthly production capacity by about 20% next year from its original target to 35,000 pieces.

Industry insiders said that the increase in orders from TSMC's five major customers shows that the rising demand for AI applications has led to an explosion in demand for chips such as graphics processors (GPUs) and AI accelerators.

In response to the continued increase in demand for AI, TSMC has previously announced that it will double and expand its CoWoS advanced packaging production capacity next year, but the company did not disclose monthly production capacity figures.

Industry insiders revealed that TSMC's CoWoS advanced packaging production capacity will not only double next year, but will also increase by another 20% from the original target, bringing the total monthly production capacity to 35,000 pieces.