SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK releases industry’s lowest profile inductors for power circuits
  • 0

TDK releases industry’s lowest profile inductors for power circuits

SemiMediaEdit
October 30, 2023

October 30, 2023 /SemiMedia/ -- TDK Corporation recently announced the launch of its new PLEA85 series of high-efficiency power inductors, developed specifically to reduce runtime in battery-powered wearables and other devices. The new series has the lowest profile in the industry, due to the use of TDK’s newly developed low-loss magnetic material and its thin-film processing techniques. Mass production of the product series began this month, October 2023.

Measuring just 1.0 mm (L) x 0.8 mm (W) x 0.55 mm (H), the PLEA85 series enables engineers to miniaturize their design and take full advantage of low-profile ICs such as CSP. The bottom electrode and partly L-shaped form on the side makes suitable for high-density surface mounting, helps suppress misplacement during mounting and improves terminal strength to create a more robust end-product.

It is anticipated that wearable devices with increased performance and density will be developed in the future. Accordingly, demand for thinner, lighter and smaller electronic components will increase. TDK will widen its lineup of high-efficiency small-sized and low-profile inductors that will be key parts of power circuits to fulfill market needs.

Main applications

  • Wearable devices like true wireless stereo (TWS) earphones, hearing aids and smartwatches
  • Small-sized power supply modules

Related

electronic components news Electronic components supplier Electronic parts supplier PLEA85 TDK
Samsung Electro-Mechanics selected as key supplier to Hyundai Motor Company and Kia Motors
Previous
SEMI: Global silicon wafer shipment growth to rebound in 2024 after decline in 2023
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Global chip sales jump over 60% in February on strong demand

Global chip sales jump over 60% in February on strong demand

April 13, 2026
0
Murata starts mass production of high-capacitance automotive MLCCs

Murata starts mass production of high-capacitance automotive MLCCs

April 13, 2026
0
Samsung plans $4 billion chip packaging plant in Vietnam

Samsung plans $4 billion chip packaging plant in Vietnam

April 13, 2026
0
Samsung advances 2nm GAA push with Taylor fab targeting 2026 start

Samsung advances 2nm GAA push with Taylor fab targeting 2026 start

April 9, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Electronic components distributor
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator