SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Murata announced joint venture company for the production of MLCC raw materials
  • 0

Murata announced joint venture company for the production of MLCC raw materials

SemiMediaEdit
March 20, 2023

Mar. 20, 2023 /SemiMedia/ -- Murata Manufacturing Co., Ltd. announced the resolution to enter into a joint venture agreement with Ishihara Sangyo Kaisha, Ltd. and Fuji Titanium Industry Co., Ltd. to establish a joint venture company MF material, Co., Ltd., to produce barium titanate used in multilayer ceramic capacitors and other products.

Barium titanate, a material used in multilayer ceramic capacitors, is becoming increasingly important in anticipation of further growth in demand for multilayer ceramic capacitors amidst the rapid development of IT devices and the electrification of automobiles.

The joint venture company has a plan to construct a new plant in Nobeoka City, Miyazaki Prefecture, for enhancing the production capacity of barium titanate and will seek to achieve further improvement in quality and productivity by combining the respective manufacturing technologies and know-how that Fuji Titanium and the Company have cultivated.

The joint venture company will be established whereby Fuji Titanium will execute a company split to separate main assets, liabilities, and other items related to the barium titanate manufacturing business, following whichFuji Titanium, Murata and Ishihara Sangyo will take a 55%, 35% and 10% stake, respectively.

Related

electronic components news Electronic components supplier Electronic parts supplier Murata
TDK releases compact high-current choke coils for automotive and industrial applications
Previous
Kyocera AVX announces joining the Nordic Partner Program
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay launches compact proximity sensor with 600 mm detection

Vishay launches compact proximity sensor with 600 mm detection

May 7, 2026
0
AI demand keeps 3nm and CoWoS capacity tight through 2027

AI demand keeps 3nm and CoWoS capacity tight through 2027

May 7, 2026
0
Musk-backed Terafab chip project may reach $119 billion investment

Musk-backed Terafab chip project may reach $119 billion investment

May 7, 2026
0
Murata introduces bulk case packaging to replace T&R, improving MLCC supply chain efficiency

Murata introduces bulk case packaging to replace T&R, improving MLCC supply chain efficiency

May 6, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator