Dec. 12, 2022 /SemiMedia/ -- Texas Instruments recently announced that the company's newest 300mm fab, LFAB, in Lehi, Utah, has begun producing analog and embedded products.
LFAB, which Texas Instruments acquired Micron in July 2021, is Texas Instruments' second 300mm fab to begin semiconductor production in 2022, providing its customers with the manufacturing capacity they need for decades to come.
Located in the heart of Utah’s Silicon Slopes community, less than an hour from Salt Lake City, LFAB is the only 300-mm semiconductor wafer fab in Utah.
TI said adding LFAB to its manufacturing operations would add 300mm of capacity to support the continued growth of semiconductors in electronics. The fab has more than 275,000 square feet of cleanroom space, and the highly advanced facility includes a 7-mile-long overhead conveyor system that quickly transports wafers throughout the fab. Over time, the company's total investment in the Lehi fab will amount to approximately $3 billion to $4 billion.
LFAB has the capability to support 65-nanometer and 45-nanometer technologies with the ability to go beyond those nodes as required, and has optimal process technology to produce complex devices like embedded processing chips. At full production, LFAB will manufacture tens of millions of chips daily that will go into electronics everywhere – from renewable energy sources to electric vehicles to space telescopes.
