SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Nikkei Asia:global semiconductor market will shrink by 4% in 2023
  • 0

Nikkei Asia:global semiconductor market will shrink by 4% in 2023

SemiMediaEdit
December 1, 2022

Dec. 1, 2022 /SemiMedia/ -- According to Nikkei Asia, the global semiconductor market is expected to shrink by 4% to US$557 billion in 2023, the first annual contraction since 2019.

Chipmakers have ramped up production in response to past supply constraints, but consumer demand for devices such as smartphones and computers has begun to decline, the report said. In addition, the growth of global server shipments is expected to slow from 5.1% this year to 2.8% in 2023, and the memory chip market is expected to decline by 17%

According to WSTS forecasts, Japan, the United States and Europe will see growth in 2023. But the rest of the Asia-Pacific region, which includes China, is expected to decline by 7.5%. This is mainly due to the US's restrictions on the export of chip technology to China, as well as the impact of China's epidemic prevention and control on the output of factories.

Related

electronic components news Electronic components supplier Electronic parts supplier Global chip market Global semiconductor market
Infineon introduces SLC26P security controller for payment applications
Previous
Renesas wins BYD NEV's annual "Outstanding Strategic Partner" Award
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Supply chain sources say TSMC and Winbond are working on WoW memory stacking for AI chips

Supply chain sources say TSMC and Winbond are working on WoW memory stacking for AI chips

June 29, 2026
0
VIS says 8-inch foundry capacity remains tight as AI-related demand grows

VIS says 8-inch foundry capacity remains tight as AI-related demand grows

June 29, 2026
0
Samsung plans 1,000 trillion won investment in AI and semiconductor infrastructure

Samsung plans 1,000 trillion won investment in AI and semiconductor infrastructure

June 26, 2026
0
onsemi to acquire Synaptics in $7 billion all-stock deal

onsemi to acquire Synaptics in $7 billion all-stock deal

June 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic components distributor
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator