According to reports, ASE held the ground-breaking ceremony of the new plant in Penang, Malaysia yesterday, and announced that it will invest US$300 million within five years to expand the Malaysian production plant and purchase advanced equipment. The construction of the new plant is expected to be completed in 2025.

ASE pointed out that the two new semiconductor packaging and testing plants have a construction area of 982,000 square feet. When completed, the new plant will have a total floor area of 2 million square feet, double the size of the current plant.

ASE added that driven by the demand for 5G, artificial intelligence, high-performance computing and automotive electronics, the semiconductor industry has grown rapidly, and professional outsourced semiconductor assembly and testing (OSAT) has become an indispensable part of the global electronics supply chain.