According to reports, Bosch recently announced that it will invest 3 billion euros in its semiconductor business expansion by 2026.
The budget will include 170 million euros for the company to set up development centers in Reutlingen and Dresden, and another 250 million euros for the upgrade of the wafer fabrication facilities, which will increase the clean room area by about 3,600 square meters.
In addition to the expansion of production capacity, Bosch will further increase the development of new products and new processes. In addition to the silicon carbide devices that have achieved mass production, Bosch is studying high-voltage gallium nitride power devices for vehicles.
In addition, Bosch revealed that it plans to expand its product layout in the field of system-on-chip (SoC) and MEMS, such as micro-sensors that provide integrated radar radio frequency for autonomous driving , and MEMS micro-projection modules that can be used in AR devices.
So far, Bosch has 8-inch and 12-inch wafer fabrication facilities in Reutlingen and Dresden, respectively, and is building a semiconductor test center in Penang, Malaysia, which is expected to be operational by 2023.
