SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK introduces compact SMT common mode chokes for low-voltage applications
  • 0

TDK introduces compact SMT common mode chokes for low-voltage applications

SemiMediaEdit
June 16, 2022

TDK Corporation has released three compact EPCOS SMT common mode choke coils specially developed for low voltage applications. They sustain voltages of up to 48 V AC (50/60 Hz) and 80 V DC, and continuous currents between 1.8 A and 19 A at an ambient temperature of 40 °C. The new series cover a range of inductance values between 0.59 mH and 5.6 mH.

Particularly noteworthy are the compact dimensions of the new EMC components. Depending on the type, the surface area required is just between 12.7 x 12.7 mm and 30.99 x 25.4 mm, with heights of 5.46 mm to 12.7 mm.

The design and materials of the RoHS-compatible EMC components comply with UL 94 V-0 and offer a relatively high leakage inductance of up to 1.2 percent of the nominal inductance, which reliably suppresses common-mode interference.

Areas of application for the new common-mode chokes include DC/DC converters or low-voltage. Further information on the products can be found under http://www.tdk-electronics.tdk.com/data_chokes.

Related

B8272 electronic components news TDK
Allegro issues price increase notice
Previous
Renesas announces investment in Arduino
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator