SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASE invests $45.2 million to expand IC packaging and testing capacity
  • 0

ASE invests $45.2 million to expand IC packaging and testing capacity

SemiMediaEdit
April 22, 2022

According to reports, the semiconductor packaging and testing leader ASE announced that it will spend NT$1.325 billion (approximately $45.2 million) to build a factory to expand its IC packaging and testing production line. The new factory is expected to be completed in the third quarter of 2024.

Although ASE has not disclosed the future investment amount of the new factory, the industry estimates that it will be more than NT$10 billion.

According to public information, ASE occupies a 40% market share in the global back-end packaging and testing market. In 2021, its revenue reached NT$569.9 billion, and its operating profit was NT$62.1 billion, an increase of 78% over 2020, exceeding the company's previous expectations.

Related

ASE electronic components news IC packing and testing market
Mouser named onsemi 2021 Global High Service Distributor
Previous
Kyocera invests $486 million to expand semiconductor parts factory in Kagoshima, Japan
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Murata to raise EMI component prices on rising silver costs

Murata to raise EMI component prices on rising silver costs

March 20, 2026
0
Vishay launches space-grade common mode choke for GaN and SiC designs

Vishay launches space-grade common mode choke for GaN and SiC designs

March 20, 2026
0
Lattice to raise FPGA prices by 10% on rising backend costs

Lattice to raise FPGA prices by 10% on rising backend costs

March 20, 2026
0
TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

March 19, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • Electronic components distributor
  • NXP

SemiMediaEdit

Administrator