SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Analog Devices, Micron, and Intel join semiconductor alliance
  • 0

Analog Devices, Micron, and Intel join semiconductor alliance

SemiMediaEdit
April 8, 2022

According to reports, Intel, Micron, Analog Devices and MITRE Engenuity have announced a cooperation agreement to jointly conduct semiconductor research, development and prototyping.

MITRE Engenuity has been committed to promoting the construction of the National Semiconductor Technology Center (NSTC) in recent years, aiming to ensure that basic research and cutting-edge innovation achievements are transferred from laboratory to Industry.

"By building an innovative partnership based on trust and neutrality, Intel, Micron, Analog Devices, and MITRE Engenuity, through the Semiconductor Alliance, are aligning the interests of industry, government, and universities to collaborate and grow America's semiconductor industry." MITRE Vice President and Chief Acceleration Officer Laurie Giandomenico said.

Related

ADI electronic components news MICRON
STM introduces AMOLED Power Management IC to improve portable device viewing experience and battery runtime
Previous
TDK releases new Y2 capacitors for high-temperature requirements
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator