SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TE issues price increase notice
  • 0

TE issues price increase notice

SemiMediaEdit
December 29, 2021

On December 15th, TE Connectivity (TE) issued a price increase notice to its customers, stating that it will increase the price of its products by 5% to 10%.

TE stated in the notice that the entire market has experienced unprecedented volatility and challenges recently. TE remains committed to limiting the impact of these fluctuations on customers. However, despite their continuous efforts to optimize operating costs, these effects have posed significant challenges to TE.

TE stated that they are no longer able to bear all the increased costs as they did in the past. They have no choice but to raise prices to help offset these headwinds.

TE's price adjustments include the following:

  • Price lists will be adjusted among +5% to +10%.
  • Orders placed on or after December 20, 2021 will reflect the new prices.
  • For those customers with agreement-priced purchase orders as of July 5th with original schedule commit dates after July 5th will be adjusted to the new pricing.

Related

electronic components news TE TE Connectivity increase prices
NXP | Enhancing security design with NXP’s secure CAN transceivers
Previous
Samsung suspends NAND factory in Xi'an due to Covid-19
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator