SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TAIYO YUDEN ends wireless module business
  • 0

TAIYO YUDEN ends wireless module business

SemiMediaEdit
October 15, 2021

TAIYO YUDEN CO., LTD. (“TAIYO YUDEN”) announced yesterday that TAIYO YUDEN and KAGA FEI Co., Ltd. (“KAGA FEI”) signed a contract regarding transfer of TAIYO YUDEN’s Wireless Module business (the “Business”) to KAGA FEI. The transaction will be completed on January 1, 2022.

TAIYO YUDEN mentioned in the announcement that as IoT devices have become widely used, demand in the market for Bluetooth® modules and wireless LAN modules is expected to continue to grow. TAIYO YUDEN has been engaged in providing wireless modules, leveraging its excellent product development capability and support system. However, TAIYO YUDEN concluded the transfer contract of the Business with KAGA FEI, deeming that TAIYO YUDEN must concentrate its management resources on the Electronic Components business, including multilayer ceramic capacitors, which is the core business of TAIYO YUDEN, to achieve the goals of the Medium-Term Management Plan 2025.

Related

electronic components news Kaga FEI Taiyo Yuden Taiyo Yuden wireless module
ESD: Electronic system design industry saw double-digit year-over-year growth in Q2 2021
Previous
xMEMS announced mass production of the world’s first true MEMS speaker
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

July 31, 2025
0
Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

July 31, 2025
0
Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

July 31, 2025
0
Littelfuse unveils foldback TVS diode series for advanced DC power protection

Littelfuse unveils foldback TVS diode series for advanced DC power protection

July 30, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator