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Microchip plans to invest $880 million to expand silicon SiC and Si capacity
TDK releases new high-performance digital MEMS accelerometer sensors
ST releases highly integrated 32-channel ultrasonic transmitter optimized for handheld scanners
TDK releases industry's first common mode filter for automotive ethernet 10BASE-T1S
Infineon announces registration of its QDPAK and DDPAK packages as JEDEC standard for high power applications
ROHM introduces new Compact Smart Low-Side Switches
AXTEK launches multi-function LCD driver IC
Infineon launches new PDM microphone with small package and low power consumption
STMicroelectronics introduces new single-chip antenna-matching ICs
Vishay introduces automotive-grade polymer tantalum chip capacitors combining low ESR and high volumetric efficiency
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