IC Insights recently released the latest report listing the 25 largest monthly installed capacity of 200mm equivalent wafers in the world as of December 2020.
According to the report, the top five wafer capacity manufacturers have a monthly capacity of at least 1.5 million wafers. In 2020, the total production capacity of the top five manufacturers accounted for 54% of global wafer production capacity, an increase of 1% from the previous year. In contrast, in 2009, the top 10 wafer capacity accounted for 54% of the global total capacity, and the top 5 wafer capacity accounted for 36%.
After the top five, wafer capacity at other semiconductor leaders quickly falls off. Intel (884K wafers/month), UMC (772K wafers/month), GlobalFoundries, Texas Instruments, and SMIC rounded out the top 10 capacity leaders.
The report shows that Samsung has the largest installed wafer capacity, with 3.1 million 200mm-equivalent wafers per month, which is equivalent to 14.7% of the total global production capacity. TSMC ranks second with a monthly production capacity of approximately 2.7 million pieces, accounting for 13.1% of the total global production capacity. Micron ranked third, with a monthly production capacity of approximately 1.9 million pieces, accounting for 9.3% of the global total. SK Hynix ranked fourth, with a monthly production capacity of close to 1.9 million pieces, accounting for 9% of global production capacity, of which more than 80% are used for DRAM and NAND chips. Kioxia ranked fifth, with a monthly production capacity of 1.6 million pieces, accounting for 7.7% of the total global capacity, including a large number of NAND chips for Western Digital.
In addition, The industry’s five biggest pure-play foundries—TSMC, UMC, GlobalFoundries, SMIC, and Powerchip (including Nexchip)—are each ranked within the top 12 capacity leaders. In total, these five foundries had a combined capacity of about 5.1 million wafers per month as of December 2020, representing about 24% of the total fab capacity in the world.
