TDK Corporation announces the worldwide availability of the Chirp CH101 ultra-low power integrated ultrasonic Time-of-Flight (ToF) range sensor platform solution, which includes the CH101 MEMS sensor, sensor modules, and developer kits. Chirp’s MEMS ultrasonic technology leverages a proprietary Time-of-Flight (ToF) range sensor in a 3.5 mm x 3.5 mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a low-power mixed-signal ASIC. As the first commercially available MEMS-based ultrasonic ToF sensor, it is ultra-low power, compact, immune to lighting conditions and target composition/color, has a configurable Field-of-View (FoV), and a flexible DSP capable of handling a variety of ultrasonic signal-processing algorithms.
The CH101 enables flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence/proximity sensing, object-detection/avoidance, material composition, as well as wearable range-sensing tags to enable social distancing and contact tracing to help people remain safely distanced from one another, during COVID-19 and other scenarios.
Sensor platform solution:
CH101
The CH101 MEMS sensor provides accurate range measurements to targets up to 1.2m away. Using ultrasonic time-of-flight measurements, the sensor works in any lighting condition, including full sunlight, and provides millimeter-level accuracy, independent of the target’s color and optical transparency.
DK-CH101
Developer Kit for prototyping with one or more ToF sensors. The DK-CH101 includes one CH101 with the option to add up to four additional ultrasonic modules.
EV_MOD_CH101-03-01
Easy-to-use module for rapid integration and evaluation of hardware designs. Different acoustic housings available to adjust the field of view.
MOD_CH101-03-02
Complete module solution with a 45° FoV acoustic housing and IP5 particle ingress filter for rapid mass production and accelerated time to market
For additional information and collateral, please visit https://invensense.tdk.com/technology/ultrasonic.
