TSMC plans to issue US$4 billion unsecured corporate bonds to expand production capacity
Yesterday, TSMC announced that the board of directors approved the proposed issuance of two unsecured US dollar corporate bonds, with a total amount capped at US$4 billion for capital needs for production capacity expansion.
TSMC stated that the US dollar unsecured corporate bond fundraising will be divided into two issues, one of which is an unsecured US dollar corporate bond with a cap of 1 billion US dollars; in addition, it will issue a second unsecured US dollar corporate bond through a 100% shareholding subsidiary TSMC Global within a quota of no more than US$3 billion.
Industry insiders pointed out that from a business perspective, the purpose of TSMC's move is to increase its 5-nanometer production capacity and to accelerate the 3-nanometer trial production in order to expand its leading edge with competitors.
The article is originally written by @SemiMediaEdit posted on SemiMedia. All rights reserved.