SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › LG Innotek announces withdrawal from PCB business
  • 0

LG Innotek announces withdrawal from PCB business

SemiMediaEdit
December 2, 2019

According to BusinessKorea report last week, LG Innotek will withdraw from the HDI market and strategically shift resources to the semiconductor business.

According to the report, LG Innotek announced that it has decided to terminate the printed circuit board (PCB) business, which is an HDI business and accounts for 3.1% of the company's total sales. LG Innotek is expected to end PCB production within this year and stop selling PCBs in June next year.

LG Innotek explained that the HDI business is weak due to declining demand for high value-added products from mobile devices and increasing competition. In fact, the company had stated earlier that it was considering exiting the HDI business.

Analysts said LG Innotek's PCB business sales rely on LG smartphones. This year, LG Innotek's PCB production is about 156,000, which is less than 30% of the annual output between 2013 and 2016.

LG Innotek pointed out that after closing the PCB business, some resources will be transferred to its semiconductor business, and its PCB employees will also be deployed to the semiconductor business. A LG Innotek spokesperson said: "We want to improve our portfolio by selecting and focusing on businesses that can grow and generate profit."

Related

electronic components news LG Innotek PCB business
Murata introduces world's first common-mode choke for Automotive Ethernet
Previous
CXMT has started production of 19nm computer DRAM products
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
8-inch wafer foundry capacity tightens in 2026 as utilization rises

8-inch wafer foundry capacity tightens in 2026 as utilization rises

January 16, 2026
0
2025 semiconductor revenue reaches $793 billion as AI demand accelerates

2025 semiconductor revenue reaches $793 billion as AI demand accelerates

January 16, 2026
0
South Korea pushes SiC and GaN power chips in foundry drive

South Korea pushes SiC and GaN power chips in foundry drive

January 15, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator