Recently, SK hynix mentioned in the media interview that in order to cope with the decline of the memory chip market, it will strengthen technology development and adjust the product structure.

For the DRAM field, SK hynix will gradually expand the production capacity of the first generation of 10 nanometers (1X), and from the second half of the year, the main products will be converted into second generation 10 nanometer (1Y) products. At the same time, SK Hynix will begin to supply 64GB modules to support the high-volume DRAM requirements of the new server chips.

In the field of NAND, Sk Hynix will focus on improving revenue in the future. To this end, SK hynix will stop the production of high-cost 36-layer and 48-layer 3D NAND, and increase the proportion of 72-layer production. In the second half of the year, it plans to use 96-layer 4D NAND products to stimulate the SSD and mobile markets. Considering the current demand, the mass production rate of the new M15 plant in Cheongju will be slower than originally planned. It is expected that SK hynix’s NAND wafer input this year will be reduced by more than 10% compared with last year.

SK hynix said that in a market where the demand for memory chips is uncertain, it will focus on reducing costs and ensuring quality.