SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Qualcomm invests $400 million to expand in India
  • 0

Qualcomm invests $400 million to expand in India

SemiMediaEdit
October 9, 2018

According to media reports, on Saturday, Qualcomm announced plans to build its largest industrial park outside the United States.

The Qualcomm campus will be located in Hyderabad, India, with a total investment of nearly $400 million, one of the largest investments by large technology companies since the establishment of the Indian state of Telangana. At the same time, the park will be Qualcomm's largest park in the world, second only to its headquarters in San Diego, and $400 million in funding will be the largest investment by Qualcomm worldwide.

On Saturday, Qualcomm executives met with IT Minister KT Rama Rao of Telang, India, to discuss the company's development plans in the city. Qualcomm said the first phase of the project will include the construction of a 1.7 million square foot office building that will accommodate approximately 10,000 employees.

 

Related

Electronic component news expand India Qualcomm
$40 billion, global chip monthly sales hit a new high
Previous
MXIC's third-quarter growth was lower than expected due to component shortage
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

February 12, 2026
0
ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

February 11, 2026
0
TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

February 9, 2026
0
Taiyo Yuden announces new part number system for passive components

Taiyo Yuden announces new part number system for passive components

February 6, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator